An Analysis on Recycling of Non-Metal Material from Waste Printed Circuit Board

S. Wang, H. Duan, W. Jia, and J. Li (PRC)


Waste Printed Circuit Board (PCBs), Recycle, CompositeMaterial, Physical Mechanism


As one of the essential parts in electronic industry, printed circuit boards (PCBs) are widely used in varieties of Electronic and Electric Equipments (EEE). The recycling of waste PCBs is becoming a popular research area. In this paper, we propose that the non-metal material in PCBs can be mixed with polypropylene as padding material to form a new composite material. The experiment demonstrates that the density of the new material is rising when the Non-Metal Additive Percentage (NMAP) increases. The mechanics performance also shows that there are dramatic rises in both bending strength and impact strength. Furthermore, a NMAP of 30% optimizes the new composite material’s mechanics performance. Additionally, the shrinking ratio performs a remarkable decline in contrast with pure polypropylene material. Therefore, the proposed recycling technique of the non-metal from PCBs may become a potentially attractive solution to reuse waste PCBs.

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