L. Elsoufi, W. Charon, M. Zoaeter, R. Lachat, and K. Khalil (France)
Homogenization, equivalent modulus, finite elements modeling, piezoelectric actuator, rigidity increment
Plate and shell laminates that include piezoelectric layers have found increasing use in modern engineering applications, especially in the field of smart structures, where the piezoelectric components are used as actuator and sensor. Many functional constraints prohibit controlling the structure by elements reported on surfaces of the object. Thus, the piezoelectric actuators and sensors necessary for the control of the structures will be integrated into this one, i.e., in material even the material of the shell. The current development of the integrated smart structures is primarily carried out in supports with thermosetting materials which constitute an obstacle to their development in the automobile sector where the parameter of recycling is dominating. For this reason, we propose to use thermoplastic materials. Unfortunately, the current processes of achieving models in smart thermoplastic structures are not directly exploitable for the integration of components such as the piezoelectric actuators and sensors which are fragile and sensitive to the temperature. The objective of this work consists on studying the thermal behavior of piezoelectric actuator in order to characterize its rigidity increment with a systematic increase of temperature by using the homogenization theory and the finite elements modeling developed under “ANSYS” and “ROBOT Millennium” software.
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