Z.J. Mao, W. Kang, F. Wang, and P. Raulefs (USA)
Multi-step process control, multi-equipment optimization, cooperative control, target optimization.
We applied the cooperative control to semiconductor manufacturing multi-step process control. We developed a cooperative control architecture that not only optimizes electrical test target, but that also optimally selects the right tools to achieve the target in least process elapsed time. The least process elapsed time represents efficiency in operation and equipment use. It takes into account least waiting time, minimal downtime of equipment and least impact of planned preventive maintenance. The cooperative control architecture we proposed has 3 tiers. It starts with the top layer target optimization. The middle layer is the tool assignment optimization based on the tool performance and tool availability. This layer uses operational information and tool performance health information to decide the best tool to use for the process step. The bottom layer is the tool level control that is run to-run control and/or statistical process control. We conducted a simulation with actual data. Comparing the simulation result with actual data not using cooperative control, we demonstrated a 30% standard deviation reduction for speed and leakage current.
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