V. Ranatunga and D. Klotzkin
Finite element analysis, residual stress, anodic bonding, optical fibre
The objective of this study is to investigate the residual stresses formed during the process of directly attaching optical fibres to v-grooves in silicon submounts under field-assisted anodic bonding. Simulations conducted with finite element model revealed that the stresses at the fibre–silicon interface exceed the fracture strength of the silica–fibre bond. These predictions are verified by experimental investigations, exposing the silica traces of fibre along the flat submount surface during the cooling process. With the introduction of 1 µm layer of compliant Al or Ti onto the v-groove promoted increased bonding area and acted as a stress-relieving layer to lower the peak residual stresses at the interface, and bonds formed with this compliant metal layer are robust at room temperature.
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